Integrated circuit having programmable voltage level line drivers and method of operation

ABSTRACT

There is disclosed, for use in an integrated circuit, an apparatus for driving a signal line in the integrated circuit. The apparatus comprises: 1) a line driver for receiving an incoming data signal and transmitting an outgoing data signal on the signal line; 2) a power source for supplying a plurality of power voltage levels to a power supply rail of the line driver; and 3) a power level controller for determining a data rate of the outgoing data signal and in response to the determination, selectively applying one of the plurality of power voltage levels to the power supply rail of the line driver to thereby modify an amplitude of the outgoing data signal.

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] The present invention is related to those disclosed in UnitedStates Patent Application Serial No. [Docket No. P04926], filedconcurrently herewith, entitled “REDUCED NOISE LINE DRIVERS AND METHODOF OPERATION”.

[0002] The above application is commonly assigned to the assignee of thepresent invention. The disclosure of this related patent application ishereby incorporated by reference for all purposes as if fully set forthherein.

TECHNICAL FIELD OF THE INVENTION

[0003] The present invention is generally directed to system-on-a-chip(SOC) devices and, in particular, to a SOC device having programmablevoltage level input-output (I/O) pads.

BACKGROUND OF THE INVENTION

[0004] In recent years, there have been great advancements in the speed,power, and complexity of integrated circuits, such as applicationspecific integrated circuit (ASIC) chips, random access memory (RAM)chips, microprocessor (uP) chips, and the like. These advancements havemade possible the development of system-on-a-chip (SOC) devices. A SOCdevice integrates into a single chip all (or nearly all) of thecomponents of a complex electronic system, such as a wireless receiver(i.e., cell phone, a television receiver, and the like). SOC devicesgreatly reduce the size, cost, and power consumption of the system.

[0005] Reductions in power consumption are particularly important in SOCdesigns. SOC devices are frequently used in portable devices thatoperate on battery power. Since maximizing battery life is a criticalobjective in a portable device, it is essential to minimize the powerconsumption of SOC devices that may be used in the portable device.Furthermore, even if an SOC device is not used in a portable device,minimizing power consumption is still an important objective. Theincreased use of a wide variety of electronic products by consumers andbusinesses has caused corresponding increases in the electrical utilitybills of homeowners and business operators. The increased use ofelectronic products also is a major contributor to the increasedelectrical demand that has caused highly publicized power shortages inCalifornia.

[0006] To minimize power consumption in electronic devices, particularlySOC devices, many manufacturers have reduced the voltage levels at whichelectronic components operate. Low power integrated circuit (IC)technology operating at +3.3 volts replaced IC technology operating at+5.0 volts. The +3.3 volt IC technology was, in turn, replaced by +1.6volt IC technology in many applications, particularly microprocessor andmemory applications.

[0007] However, reducing power supply levels also reduces performance.High frequency operations require higher voltage levels in order torapidly switch signal lines from high to low, and vice versa. Thisfrequently results in wasted power if an integrated circuit does notalways operate at high speed. For example, during a period when only arelatively low level of processing power is needed, a high performancecircuit that operates at +3.3 volts or higher will consume more energythan needed. Unfortunately, if the circuit is operated at +1.6 volts,the circuit will not be able to provide high-speed performance when itis required. Thus, circuit designers are often forced to make tradeoffsbetween power consumption and performance when selecting the operatingspeed and power supply levels of a device.

[0008] Therefore, there is a need in the art for system-on-a-chip (SOC)devices and other large scale integrated circuit devices that arecapable of operating at high frequencies while minimizing powerconsumption. In particular, there is a need for SOC devices and other ICdevices that are capable of switching to a low power mode when highperformance is not required. More particularly, there is a need for SOCdevices and other IC devices that are capable of varying power supplyvoltage levels to reduce power consumption when high performance is notrequired.

SUMMARY OF THE INVENTION

[0009] To address the above-discussed deficiencies of the prior art, itis a primary object of the present invention to provide, for use in anintegrated circuit, an apparatus for driving a signal line in theintegrated circuit. According to an advantageous embodiment of thepresent invention, the apparatus comprises: 1) a line driver capable ofreceiving an incoming data signal and transmitting an outgoing datasignal on the signal line; 2) a power source capable of supplying aplurality of power voltage levels to a power supply rail of the linedriver; and 3) a power level controller capable of determining a datarate of the outgoing data signal and in response to the determination,selectively applying one of the plurality of power voltage levels to thepower supply rail of the line driver to thereby modify an amplitude ofthe outgoing data signal.

[0010] According to one embodiment of the present invention, the linedriver comprises a complementary metal oxide silicon (CMOS) field effecttransistor (FET) inverter.

[0011] According to another embodiment of the present invention, thepower source supplies a low voltage power level substantially equal to+1.6 volts and a high voltage power level substantially equal to +3.3volts.

[0012] According to still another embodiment of the present invention,the power level controller comprises a data processor capable ofexecuting a power level control program stored in a memory coupled tothe data processor.

[0013] According to yet another embodiment of the present invention, thepower level controller further comprises a switch controlled by the dataprocessor, wherein the switch selectively connects ones of the pluralityof power voltage levels to the power supply rail in response to a switchcontrol signal generated by the data processor.

[0014] In another advantageous embodiment of the present invention, theapparatus comprises: 1) a line driver capable of receiving an incomingdata signal and transmitting an outgoing data signal on the signal line;2) an adjustable power supply capable of generating an adjustable supplyvoltage that is applied to a power supply rail of the line driver; and3) a power level controller capable of determining a data rate of theoutgoing data signal and in response to the determination, adjusting thevalue of the adjustable supply voltage level applied to the power supplyrail of the line driver to thereby modify an amplitude of the outgoingdata signal.

[0015] In one embodiment of the present invention, the line drivercomprises a complementary metal oxide silicon (CMOS) field effecttransistor (FET) inverter.

[0016] In another embodiment of the present invention, the power supplygenerates an output voltage that is continually adjustable between a lowvoltage power level and a high voltage power level.

[0017] In still another embodiment of the present invention, the powerlevel controller comprises a data processor capable of executing a powerlevel control program stored in a memory coupled to the data processor.

[0018] In yet another embodiment of the present invention, the powerlevel controller increases the value of the adjustable supply voltagelevel in response to a determination that the data rate of the outgoingdata signal is relatively high.

[0019] In a further embodiment of the present invention, the power levelcontroller decreases the value of the adjustable supply voltage level inresponse to a determination that the data rate of the outgoing datasignal is relatively low.

[0020] The foregoing has outlined rather broadly the features andtechnical advantages of the present invention so that those skilled inthe art may better understand the detailed description of the inventionthat follows. Additional features and advantages of the invention willbe described hereinafter that form the subject of the claims of theinvention. Those skilled in the art should appreciate that they mayreadily use the conception and the specific embodiment disclosed as abasis for modifying or designing other structures for carrying out thesame purposes of the present invention. Those skilled in the art shouldalso realize that such equivalent constructions do not depart from thespirit and scope of the invention in its broadest form.

[0021] Before undertaking the DETAILED DESCRIPTION OF THE INVENTIONbelow, it may be advantageous to set forth definitions of certain wordsand phrases used throughout this patent document: the terms “include”and “comprise,” as well as derivatives thereof, mean inclusion withoutlimitation; the term “or,” is inclusive, meaning and/or; the phrases“associated with” and “associated therewith,” as well as derivativesthereof, may mean to include, be included within, interconnect with,contain, be contained within, connect to or with, couple to or with, becommunicable with, cooperate with, interleave, juxtapose, be proximateto, be bound to or with, have, have a property of, or the like; and theterm “controller” means any device, system or part thereof that controlsat least one operation, such a device may be implemented in hardware,firmware or software, or some combination of at least two of the same.It should be noted that the functionality associated with any particularcontroller may be centralized or distributed, whether locally orremotely. Definitions for certain words and phrases are providedthroughout this patent document, those of ordinary skill in the artshould understand that in many, if not most instances, such definitionsapply to prior, as well as future uses of such defined words andphrases.

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] For a more complete understanding of the present invention, andthe advantages thereof, reference is now made to the followingdescriptions taken in conjunction with the accompanying drawings,wherein like numbers designate like objects, and in which:

[0023]FIG. 1 illustrates a data processing system that comprises anexemplary system-on-a-chip (SOC) device according to one embodiment ofthe present invention;

[0024]FIG. 2 illustrates a high-level signal interface of theinterconnection of exemplary split transaction, unidirectional businterface (IF) unit and other bus devices in FIG. 1 according to theprinciples of the present invention;

[0025]FIG. 3 illustrates the signal interface which defines theinterconnection of the exemplary bus IF unit, bus control processor, andone bus device in FIG. 2 in greater detail according to one embodimentof the present invention;

[0026]FIG. 4 illustrates exemplary power level adjusting circuitryaccording to one embodiment of the present invention;

[0027]FIG. 5 illustrates a variable voltage line driver in greaterdetail according to an exemplary embodiment of the present invention;and

[0028]FIG. 6 is a timing diagram of important signals illustrating theoperation of the variable voltage line driver according to exemplaryembodiments of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0029]FIGS. 1 through 6, discussed below, and the various embodimentsused to describe the principles of the present invention in this patentdocument are by way of illustration only and should not be construed inany way to limit the scope of the invention. Those skilled in the artwill understand that the principles of the present invention may beimplemented in any suitably arranged data processing system.

[0030]FIG. 1 illustrates processing system 100, which comprisesexemplary system-on-a-chip (SOC) device 105 according to one embodimentof the present invention. SOC device 105 is a single integrated circuitcomprising processor core 110, graphics rendering block 120, (optional)display control circuit 130, memory 140, bandwidth matching-clocksynchronization interface 150, peripheral interface 160, splittransaction, unidirectional bus interface (IF) unit 170 (or bus IF unit170), and bus control processor 180. Processor core 110 containsinternal level one (L1) cache 115. Peripheral interface 160 communicateswith external device 190.

[0031] Processing system 100 is shown in a general level of detailbecause it is intended to represent any one of a wide variety ofelectronic products, particularly consumer appliances. Displaycontroller 130 is described above as optional because not allend-products require the use of a display. Likewise, graphics renderingblock 120 may also be optional.

[0032] For example, processing system 100 may be a printer renderingsystem for use in a conventional laser printer. Processing system 100also may represent selected portions of the video and audiocompression-decompression circuitry of a video playback system, such asa video cassette recorder or a digital versatile disk (DVD) player. Inanother alternative embodiment, processing system 100 may compriseselected portions of a cable television set-top box or a stereoreceiver.

[0033] Bus IF unit 170 provides high-speed, low latency communicationpaths between the components coupled to bus IF unit 170 Each componentcoupled to bus IF unit 170 is capable of initiating or servicing datarequests via four unidirectional bus interfaces: two request buses and atwo data buses. The request bus contains address lines, byte enablelines (32-bit or 64-bit data reads), cycle type lines, and routinginformation for transactions. The data bus contains data lines, byteenable lines (for data writes), completion status lines, and routinginformation to associate the data bus packets with the appropriaterequest bus packet. As noted, the four buses are unidirectional andpoint-to-point to minimize loading and timing variations. In addition,bus IF unit 170 provides a diagnostic bus, power management controls,clocks, reset signals, and a scan interface.

[0034] Bus IF unit 170 implements a transaction protocol that definesthe mechanism for transferring packets between devices coupled to bus IFunit 170. In addition, the transaction protocol defines the control forclocks and power management. The packet protocol standardizes the systemlevel interactions between devices coupled to bus IF unit 170. Thehardware requirements for mapping transactions, arbitrating packets, andmaintaining coherency is specified in the packet protocol.

[0035] Bandwidth matching-clock synchronization interface 150 comprise aqueue that bridges ports on bus IF unit 170 that have different widthsor different frequencies, or both. Bus control processor 180 controlscertain operations of bus IF unit 170 related to clock timing, powermanagement, and diagnostic features.

[0036] Peripheral interface 160 is a bus device used for chip-to-chipcommination between SOC device 105 and an external peripheral device,such as external device 190.

[0037]FIG. 2 illustrates high-level signal interface 200, which definesthe interconnection of exemplary split transaction, unidirectional businterface (IF) unit and other bus devices in FIG. 1 according to theprinciples of the present invention. In the illustrative embodiment, afirst split transaction, unidirectional bus interface unit (i.e., bus IFunit 170A) is coupled to, and transfers data between, memory 240, buscontrol processor 180, bus device 210A, bus device 210B, and a secondsplit transaction, unidirectional bus interface unit (i.e., bus IF unit170B). Bus IF unit 170B is coupled to, and transfers data between, busdevices 210C-210F, peripheral interface 260, and bus IF unit 170A.

[0038] In the illustrative embodiment, bus IF unit 170A uses separateinterfaces to transfer data with bus device 210A, bus device 210B, buscontrol processor 180, and bus IF unit 170B. Each of the separateinterfaces comprises four unidirectional buses. The unidirectional busesin each interface are REQUEST OUT, REQUEST IN (abbreviated REQ. OUT andREQ. IN, respectively), DATA OUT, and DATA IN. Similarly, bus IF unit170B uses separate interfaces to transfer data with bus devices210C-210F, peripheral interface 260, and bus IF unit 10A.

[0039] A data read request from a requesting one of bus devices210A-210F is transmitted from bus IF unit 170A or bus IF unit 170B to areceiving one of bus devices 210A-210F that has the requested data viaone of the REQUEST IN buses. The requested data is then transmitted outon the corresponding DATA OUT bus. Similarly, a write request from arequesting one of bus devices 210A-210F is transmitted from bus IF unit170A or bus IF unit 170B to a receiving one of bus devices 210A-210F towhich the data is to be written via one of the REQUEST IN buses. Theincoming data is then received on the corresponding DATA IN bus. Arequesting one of bus devices 210A-210F transmits read and writerequests on the REQUEST OUT bus.

[0040] For example, bus device 210A may write data to bus device 210B byfirst transmitting to bus IF unit 170A a write data request on theREQUEST OUT bus coupling bus device 210A and bus IF unit 170A. Busdevice 210A also transmits the write data to bus IF unit 170A on theDATA OUT bus coupling bus device 210A and bus IF unit 170A. Next, bus IFunit 170A transmits the write data request to bus device 210B on theREQUEST IN bus coupling bus device 210B and bus IF unit 170A. Bus IFunit 170A also transmits the write data to bus device 210B on the DATAIN bus coupling bus device 210B and bus IF unit 170A.

[0041] Furthermore, a bus device coupled to bus IF unit 170A can readdata from, or write data to, a bus device coupled to bus IF unit 170B(including peripheral interface 260) via the four bus interfaceconnecting bus IF unit 170A and bus IF unit 170B. Similarly, a busdevice coupled to bus IF unit 170B (including peripheral interface 260)can read data from, or write data to, a bus device coupled to bus IFunit 170A via the four bus interface connecting bus IF unit 170A and busIF unit 170B.

[0042] In the exemplary embodiment in FIG. 2, bus IF unit 170A is coupleto memory 240 by only three buses, namely the REQUEST IN bus, the DATAOUT bus, and the DATA IN bus. A REQUEST OUT bus is not used to couplebus IF unit 170A and memory 240 because memory 240 does not normallyinitiate read operations and write operations.

[0043]FIG. 3 illustrates in greater detail signal interface 300, whichdefines the interconnection of bus IF unit 170A, bus control processor180, and bus device 210A according to one embodiment of the presentinvention. As before, bus IF unit 170A is coupled to bus device 210A byfour independent buses (REQUEST OUT, REQUEST IN, DATA OUT, and DATA IN).Bus IF unit 170A also is coupled to bus device 210A by several controlsignal lines, namely ASMI, ERR, and DIAGNOSTIC. Each port has anindependent interface. Thus, there are no tri-state signal lines.

[0044] Bus device 210A initiates requests on the REQUEST OUT bus whenbus device 210A operates as a master and receives requests on theREQUEST IN bus when bus device 210A operates as a slave. Write data andresponses are initiated on the DATA OUT bus and transmitted to thetarget bus device (master or slave) on the DATA IN bus. All the buseshave a similar control interface. The data bus width (e.g., 16 bits, 32bits) may vary based on the bandwidth desired for a given application.The asynchronous system management interrupt (ASMI) signal provides amechanism for bus device 210A to request a system management interrupt.The error (ERR) signal indicates an error that is not associated with aparticular bus transfer.

[0045] Bus device 210A receives clock and reset (CLOCK/RESET) signalfrom bus control processor 180. Bus control processor 180 also providescontrol signals for performing scan, test, and/or built-in self test(BIST) functions. Optionally, bus device 210A may provide a DIAGNOSTICbus that is coupled to bus IF unit 170A. The DIAGNOSTIC bus is group ofimportant internal signals selected by the module designer. TheDIAGNOSTIC bus may be multiplexed with diagnostic buses from other busdevices in bus IF unit 170A.

[0046] As is well known, the speed at which the components in SOC device105 operate is determined in part by the voltage levels of the powersupply rails in those components. A higher supply voltage drives largercurrents through the transistors in the logic gates in the components inSOC device 105. This results in faster switching times and allows ahigher operating frequency to be used. Unfortunately, a higher operatingvoltage also increases power consumption. This is particularly true withrespect to data buses that interconnect, or are internal to, thecomponents in SOC device 105. Long signal lines must be driven atrelatively high voltages (and high power consumption) in order to switchrapidly between a high voltage (Logic 1) and a low voltage (Logic 0)during high frequency operations. However, when it is not necessary tooperate at high frequency, a lower power supply voltage would besufficient. In order to minimize the power consumed by the components ofSOC device 105, including especially bus IF unit 170, peripheralinterface 160, memory 140, and bandwidth matching-clock synchronizationinterface 150, the present invention provides a unique apparatus and arelated method for adjusting the power supply voltage levels that areapplied to selected line drivers in SOC device 105.

[0047]FIG. 4 illustrates power level adjusting circuitry, generallydesignated 400, according to one embodiment of the present invention.Power level adjusting circuitry 400 comprises variable level powersources 410, switch 420, variable voltage level line driver 430,processor core 110, and memory 140, which contains output voltagecontrol program 440. Variable voltage level line driver 430 receives theunscaled DATA OUT signal and outputs a scaled DATA OUT signal. Variablevoltage level line driver 430 is intended to represent any circuit thatdrives a data, address, or control line in SOC device 105. As will bediscussed below in greater detail, the amplitude of the scaled DATA OUTsignal may be adjusted according to the speed at which variable voltagelevel line driver 430 is operating. During times when variable voltagelevel line driver 430 is driving the scaled DATA OUT signal at highfrequency, the voltage level of variable voltage level line driver 430may be increased to, for example, +3.3 volts. During times when variablevoltage level line driver 430 is driving the scaled DATA OUT signal at arelatively low frequency, the voltage level of variable voltage levelline driver 430 may be decreased to, for example, +1.6 volts, therebysaving power.

[0048] Variable voltage level line driver 430 may be any one of avariety of known line driver circuits, such as an non-inverting buffer,or a simple inverter. For example, variable voltage level line driver430 may be a conventional CMOS inverter comprising a P-type transistorand a N-type transistor. By selectively applying a smaller (e.g., +1.6volts) or a larger (e.g., +3.3 volt) voltage to the power supply rail ofthe CMOS inverter, the switching speed of the CMOS inverter output canbe decreased or increased.

[0049] Variable level power sources 410 represent a plurality of powersupply voltages that may be generated on-chip (internally) by SOC device105, or may be provided by external power supplies, or both. In theillustrated embodiment, the exemplary values of +3.3 volts and +1.6volts are selected for purposes of illustration only. Those skilled inthe art will recognize that other voltage levels may also be chosen.

[0050] According to one embodiment of the present invention, thevariable power supply voltage may be selectively applied to variablevoltage level line driver 430 by switch 420. This may be done adjustablyby switching the variable power supply voltage between differentdiscreet levels (i.e., +3.3 volts and +1.6 volts) using the SWITCHSELECT control signal from processor core 110. Alternatively, this maybe done on a permanent basis (according to the specific application)when SOC device 105 is embedded in a circuit board and the position ofswitch 420 is selected by an external voltage coupled to the SWITCHSELECT control signal line.

[0051] In still another embodiment, the variable power supply voltagemay be varied through a range of voltage levels by the LEVEL SELECTcontrol signal. In such an embodiment, switch 420 (optionally) may beomitted and the output of variable voltage power sources 410 may becoupled directly to the power supply rail of variable voltage level linedriver 430. The LEVEL SELECT control signal generated by processor core110 may be a N-bit signal capable of adjusting the output of variablevoltage power sources 410 to any one of 2^(N) voltage levels.Alternatively, the LEVEL SELECT control signal generated by processorcore 110 may be an analog signal capable of adjusting the output ofvariable voltage power sources 410 to any level in a continuous rangebetween a predetermined minimum level and a predetermined maximum value.

[0052] According to an advantageous embodiment of the present invention,processor core 110 sets the position of switch 420 using the SWITCHSELECT signal, or adjusts the output level of variable voltage powersources 410 using the LEVEL SELECT signal, by executing output voltagecontrol program 440 stored in memory 440. Output voltage control program440 may determine the appropriate voltage level on the scaled DATA OUTsignal at the output of variable voltage level line driver 430 accordingto the frequency of the scaled DATA OUT signal. If variable voltagelevel line driver 430 must drive the scaled DATA OUT signal at a highdata rate, output voltage control program 440 can increase the voltagelevel supplied to the power supply rail of variable voltage level linedriver 430 by making an appropriate adjustment to the value of the LEVELSELECT signal. When it is no longer necessary to drive the scaled DATAOUT signal at a high data rate, output voltage control program 440 candecrease the voltage level by adjusting the value of the LEVEL SELECTsignal voltage, thereby saving power. It is noted that output voltagecontrol program 440 need not be a stand alone program, but may insteadbe a sub-routine in a larger application program.

[0053] For example, if SOC device 105 is part of a cellular telephoneand the scaled DATA OUT signal drives the transceiver portion of thecellular telephone, the voltage level supplied to the power supply railof variable voltage level line driver 430 may be kept low during timeperiods when the cellular phone is accessing the wireless network butnot actively conducting a phone call. During such an idle period, thecellular phone may only transmit intermittent acknowledgment signals ata low data rate to the wireless network to indicate that the cellularphone is still available on the network to receive calls. Since the datarate is low, output voltage control program 440, which may be part ofthe operating system program of the cellular phone, reduces powerconsumption by reducing the voltage on variable voltage level linedriver 430. The unscaled DATA OUT signal is then driven at a lower bitrate.

[0054] However, at some point, the cellular phone may receive anincoming call or may initiate an outgoing call. When this occurs, outputvoltage control program 440 increases the power supply voltage appliedto variable voltage level line driver 430 so that the scaled DATA OUTsignal has faster switching times (i.e., faster rise times and fasterfall times). The unscaled DATA OUT signal is accordingly driven at ahigher bit rate to handle the voice and/or data traffic transmitted tothe transmitter portion of the cellular phone.

[0055] The noise margins in SOC device 105 are determined in part by thevoltage levels of the power supply rails therein. A lower supply voltagelevel reduces the noise margin in the components in SOC device 105. Thisreduced noise margin is adversely affected by, among other things,ground bounce and power supply noise caused by the ON-OFF switching ofP-type and N-type transistors in line drivers in SOC device 105. In acomplementary metal-oxide-silicon (CMOS) field effect transistor (FET)inverter driving a signal line, the P-type and N-type transistors of theCMOS inverter are both briefly ON during the transition from Logic 0 toLogic 1, and vice versa. This causes current spikes between ground andthe power supply, resulting in noise. A rapid transition from Logic 0 toLogic 1 causes overshoots and ringing on the leading edge of a Logic 1pulse. The present invention provides an improved line driver circuitcapable of reducing the power supple noise and ground bounce in SOCdevice 105.

[0056]FIG. 5 illustrates variable voltage line driver 430 in greaterdetail according to an exemplary embodiment of the present invention.FIG. 6 is a timing diagram of important signals illustrating theoperation of variable voltage line driver 430 according to exemplaryembodiments of the present invention. Variable voltage line driver 430comprises Logic 1 detector 510, Logic 0 detector 520, N-type transistor530, and P-type transistor 540. P-type transistor 540 has a sourcecoupled to the V_(DD) power supply rail and a drain coupled to the DATAOUT signal line. N-type transistor 530 has source coupled to ground anda drain coupled to the DATA OUT signal line.

[0057] P-type transistor 540 and N-type transistor 530 are connectedsimilarly to a conventional CMOS inverter, except that the gates ofP-type transistor 540 and N-type transistor 530 are not connectedtogether. Instead, the gate of P-type transistor 540 (test point B) iscoupled to the output of Logic 0 detector 520 and the gate of N-typetransistor 530 is coupled to the output of Logic 1 detector 510. As willbe described below in greater detail, variable voltage line driver 430operates as an inverting line driver.

[0058] The critical feature of Logic 1 detector 510 is that it applieswaveform A in FIG. 6 to the gate of N-type transistor 530 (test point A)in FIG. 5. Waveform A turns N-type transistor 530 slowly ON and rapidlyOFF. The critical feature of Logic 0 detector 520 is that it applieswaveform B in FIG. 6 to the gate of P-type transistor 540 (test point B)in FIG. 5. Waveform B turns P-type transistor 540 slowly ON and rapidlyOFF. It is a further critical feature of the operations of Logic 1detector 510 and Logic 0 detector 520 that N-type transistor 530 andP-type transistor 540 are never ON at the same time.

[0059] Those skilled in the art will recognize that the foregoing may beachieved in different ways, depending on the type of circuitry in Logic1 detector 510 and Logic 0 detector 520. Logic 1 detector 510 and Logic0 detector 520 may include delay elements that are triggered ontransitions from Logic 0 to Logic 1, and vice versa. Alternatively, thewaveform DATA IN may include guard barriers between Logic 1 periods andLogic 0 periods that prevent N-type transistor 530 and P-type transistor540 are never ON at the same time.

[0060] In a first exemplary embodiment of the present invention, theDATA IN 1 signal in FIG. 6 is applied to the inputs of Logic 1 detector510 and Logic 0 detector 520. In this first exemplary embodiment, Logic1 detector 510 comprises a comparator that detects when the DATA IN 1signal rises above a high threshold voltage. This is shown as a dottedline label Reference A (REF. A) in FIG. 6. Logic 0 detector 520comprises a comparator that detects when the DATA IN 1 signal fallsbelow a low threshold voltage. This is shown as a dotted line labelReference B (REF. B) in FIG. 6.

[0061] Initially, the DATA IN 1 signal is at a zero reference voltage(item 601) between the Reference A and Reference B levels. At thispoint, the output of Logic 1 detector 510 (waveform A) is at Logic 0(item 621) and the output of Logic 0 detector 520 is at Logic 1 (item631). Next, the DATA IN 1 signal goes to a Logic 1 by rising above theReference A level (item 602). Logic 1 detector 510 detects the Logic 1and the output of Logic 1 detector 510 ramps up relatively slowly (item622) to a Logic 0 (item 623). The output of Logic 1 detector 510 turnson N-type transistor 530 and the DATA OUT signal, which is initiallyLogic 1 (item 641), ramps down (item 642) to Logic 0 (item 643). Sincethe output of Logic 1 detector 510 and the DATA OUT signal are notvertical pulses, overshoots and ringing caused by the leading edges ofvertical pulse do not occur. This reduces noise in SOC device 105.

[0062] Next, the DATA IN 1 signal returns to the zero reference voltage(item 603) during a guard period (shown as delay period D2). Logic 1detector 510 detects that the Logic 1 is gone and the output of Logic 1detector 510 drops vertically to a Logic 0 (item 624). The output ofLogic 1 detector 510 turns off N-type transistor 530 and the DATA OUTsignal remains at Logic 0 (item 643) during delay period D2.

[0063] Next, the DATA IN 1 signal goes to a Logic 0 by falling below theReference B level (item 604). Logic 0 detector 520 detects the Logic 0and the output of Logic 0 detector 520 down relatively slowly (item 632)to a Logic 0 (item 633). The output of Logic 0 detector 520 turns onP-type transistor 540 and the DATA OUT signal ramps up (item 644) toLogic 1 again.

[0064] Those skilled in the art will recognize that Logic 1 detector 510may use a number of different circuits to achieve a relatively slow rampup from Logic 0 to Logic 1 and a rapid switch OFF from Logic 1 to Logic0. For example, Logic 1 detector 510 may comprise an integrator circuitthat is driven by a step function on the output of the comparator inLogic 1 detector 510. When the step output of the comparator goes fromLogic 0 to Logic 1, the output of the integrator is a ramp function. Anexemplary integrator may comprise a transistor that operates as aconstant current source to charge a capacitor. The voltage on thecapacitor is a ramp function whose slope varies in steepness accordingto the value of the capacitance. When the input to Logic 1 detector 510switches from Logic 1 back to Logic 0, the output of the comparator mayactivate a switch that shorts the capacitor to ground. This causes arapid transition from Logic 1 to Logic 0 at the output of Logic 1detector 510.

[0065] Additionally, those skilled in the art will recognize that Logic0 detector 520 may be implemented in a manner that is nearly identicalto Logic 1 detector 510. The primary difference would be the inclusionof a final inverter stage at the output of Logic 0 detector 520.

[0066] In a second exemplary embodiment of the present invention, theDATA IN 2 signal in FIG. 6 may be applied to the inputs of Logic 1detector 510 and Logic 0 detector 520. The DATA IN 2 signal does notinclude guard periods between Logic 1 and Logic 0 states. In this secondexemplary embodiment, Logic 1 detector 510 comprises a comparator thatdetects when the DATA IN 2 signal rises above a zero reference voltage.This is shown as a dotted line label Reference C (REF. C) in FIG. 6.Logic 0 detector 520 comprises a comparator that detects when the DATAIN 2 signal falls below the Reference C (REF. C) level.

[0067] In this second exemplary embodiment, the DATA IN signal switchesfrom Logic 0 to Logic 1, and vice versa with out a guard period. Toprevent N-type transistor 530 and P-type transistor 540 from both beingON at the same time, Logic 0 detector 520 and Logic 1 detector 510 maycomprise delay elements coupled to the outputs of the internalcomparators that prevent the ramp up portions of waveform B and waveformB from occurring immediately after a Logic 0 to Logic 1 transition atthe outputs of the comparators. This causes delay periods D1 and D2. Thedelay elements may be bypassed after a Logic 1 to Logic 0 transition atthe outputs of the comparators in order to ensure that N-type transistor530 and P-type transistor 540 turn OFF rapidly and without delay.

[0068] Although the present invention has been described in detail,those skilled in the art should understand that they can make variouschanges, substitutions and alterations herein without departing from thespirit and scope of the invention in its broadest form.

What is claimed is:
 1. For use in an integrated circuit, an apparatusfor driving a signal line in said integrated circuit comprising: a linedriver capable of receiving an incoming data signal and transmitting anoutgoing data signal on said signal line; a power source capable ofsupplying a plurality of power voltage levels to a power supply rail ofsaid line driver; and a power level controller capable of determining adata rate of said outgoing data signal and in response to saiddetermination, selectively applying one of said plurality of powervoltage levels to said power supply rail of said line driver to therebymodify an amplitude of said outgoing data signal.
 2. The apparatus asset forth in claim 1 wherein said line driver comprises a complementarymetal oxide silicon (CMOS) field effect transistor (FET) inverter. 3.The apparatus as set forth in claim 1 wherein said power source suppliesa low voltage power level substantially equal to +1.6 volts and a highvoltage power level substantially equal to +3.3 volts.
 4. The apparatusas set forth in claim 1 wherein said power level controller comprises adata processor capable of executing a power level control program storedin a memory coupled to said data processor.
 5. The apparatus as setforth in claim 4 wherein said power level controller further comprises aswitch controlled by said data processor, wherein said switchselectively connects ones of said plurality of power voltage levels tosaid power supply rail in response to a switch control signal generatedby said data processor.
 6. For use in an integrated circuit, anapparatus for driving a signal line in said integrated circuitcomprising: a line driver capable of receiving an incoming data signaland transmitting an outgoing data signal on said signal line; anadjustable power supply capable of generating an adjustable supplyvoltage that is applied to a power supply rail of said line driver; anda power level controller capable of determining a data rate of saidoutgoing data signal and in response to said determination, adjustingthe value of said adjustable supply voltage level applied to said powersupply rail of said line driver to thereby modify an amplitude of saidoutgoing data signal.
 7. The apparatus as set forth in claim 6 whereinsaid line driver comprises a complementary metal oxide silicon (CMOS)field effect transistor (FET) inverter.
 8. The apparatus as set forth inclaim 6 wherein said power supply generates an output voltage that iscontinually adjustable between a low voltage power level and a highvoltage power level.
 9. The apparatus as set forth in claim 6 whereinsaid power level controller comprises a data processor capable ofexecuting a power level control program stored in a memory coupled tosaid data processor.
 10. The apparatus as set forth in claim 9, whereinsaid power level controller increases said value of said adjustablesupply voltage level in response to a determination that said data rateof said outgoing data signal is relatively high.
 11. The apparatus asset forth in claim 10 wherein said power level controller decreases saidvalue of said adjustable supply voltage level in response to adetermination that said data rate of said outgoing data signal isrelatively low.
 12. A system-on-a-chip (SOC) circuit comprising: aplurality of bus devices, each of said bus devices capable oftransmitting data to a target one of said plurality of bus devices andreceiving data from said target bus device; a bus interface unit coupledto each of said plurality of bus devices, wherein said bus interfaceunit is capable of transmitting data between said plurality of busdevices; a line driver disposed in at least one of said plurality ofdevices and said bus interface device, said line driver capable ofreceiving an incoming data signal and transmitting an outgoing datasignal on a signal line in said SOC circuit; a power source capable ofsupplying a plurality of power voltage levels to a power supply rail ofsaid line driver; and a power level controller capable of determining adata rate of said outgoing data signal and in response to saiddetermination, selectively applying one of said plurality of powervoltage levels to said power supply rail of said line driver to therebymodify an amplitude of said outgoing data signal.
 13. The SOC circuit asset forth in claim 12 wherein said line driver comprises a complementarymetal oxide silicon (CMOS) field effect transistor (FET) inverter. 14.The SOC circuit as set forth in claim 12 wherein said power sourcesupplies a low voltage power level substantially equal to +1.6 volts anda high voltage power level substantially equal to +3.3 volts.
 15. TheSOC circuit as set forth in claim 12 wherein said power level controllercomprises a data processor capable of executing a power level controlprogram stored in a memory coupled to said data processor.
 16. The SOCcircuit as set forth in claim 15 wherein said power level controllerfurther comprises a switch controlled by said data processor, whereinsaid switch selectively connects ones of said plurality of power voltagelevels to said power supply rail in response to a switch control signalgenerated by said data processor.
 17. A system-on-a-chip (SOC) circuitcomprising: a plurality of bus devices, each of said bus devices capableof transmitting data to a target one of said plurality of bus devicesand receiving data from said target bus device; a bus interface unitcoupled to each of said plurality of bus devices, wherein said businterface unit is capable of transmitting data between said plurality ofbus devices; a line driver disposed in at least one of said plurality ofdevices and said bus interface device, said line driver capable ofreceiving an incoming data signal and transmitting an outgoing datasignal on a signal line in said SOC circuit; an adjustable power supplycapable of generating an adjustable supply voltage that is applied to apower supply rail of said line driver; and a power level controllercapable of determining a data rate of said outgoing data signal and inresponse to said determination, adjusting the value of said adjustablesupply voltage level applied to said power supply rail of said linedriver to thereby modify an amplitude of said outgoing data signal. 18.The SOC circuit as set forth in claim 17 wherein said line drivercomprises a complementary metal oxide silicon (CMOS) field effecttransistor (FET) inverter.
 19. The SOC circuit as set forth in claim 17wherein said power supply generates an output voltage that iscontinually adjustable between a low voltage power level and a highvoltage power level.
 20. The SOC circuit as set forth in claim 17wherein said power level controller comprises a data processor capableof executing a power level control program stored in a memory coupled tosaid data processor.
 21. The SOC circuit as set forth in claim 20wherein said power level controller increases said value of saidadjustable supply voltage level in response to a determination that saiddata rate of said outgoing data signal is relatively high.
 22. The SOCcircuit as set forth in claim 21 wherein said power level controllerdecreases said value of said adjustable supply voltage level in responseto a determination that said data rate of said outgoing data signal isrelatively low.
 23. For use in an integrated circuit, a method ofdriving a signal line in the integrated circuit comprising the steps of:generating a plurality of power voltage levels capable of being suppliedto a power supply rail of a line driver driving the signal line with anoutgoing data signal; determining a data rate of the outgoing datasignal; in response to the determination, selectively applying one ofthe plurality of power voltage levels to the power supply rail of theline driver to thereby modify an amplitude of the outgoing data signal.